Bonding device for manufacturing liquid crystal display device

ABSTRACT

A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into the bonding chamber.

[0001] This application incorporates by reference two co-pendingapplications, Ser. No. 10/184,096, filed on Jun. 28, 2002, entitled“SYSTEM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICES”(Attorney Docket Number 8733.666.00) and Ser. No. 10/184,088, filed onJun. 28, 2002, entitled “SYSTEM FOR FABRICATING LIQUID CRYSTAL DISPLAYAND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY USING THE SAME”(Attorney Docket Number 8733.684.00), as if fully set forth herein.

[0002] This application claims the benefit of Korean Patent ApplicationNos. P2002-15078 filed on Mar. 20, 2002, and P2002-15642 filed on Mar.22, 2002, which are hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND OF THE INVENTION

[0003] 1. Field of the Invention

[0004] The present invention relates to a bonding device formanufacturing a liquid crystal display device, and more particularly, toa bonding device for manufacturing a liquid crystal display device withan ionizing device.

[0005] 2. Discussion of the Related Art

[0006] In general, recent developments in the information communicationfield have increased demand for various types of displays devices. Inresponse to this demand, various flat panel type displays such as liquidcrystal display (LCD), plasma display panel (PDP), electro-luminescentdisplay (ELD), and vacuum fluorescent display (VFD) have been developed.These are used as displays for various equipments.

[0007] In particular, LCD devices have been used because of their highresolution, lightweight, thin profile, and low power consumption. Inaddition, LCD devices have been implemented in mobile devices such asmonitors for notebook computers. Furthermore, LCD devices have beendeveloped for monitors of computer and television to receive and displayimage signals.

[0008] Efforts to improve the image quality of LCD devices contrast withthe benefits of high resolution, lightweight, thin profile, and lowpower consumption. In order to incorporate LCD devices as a generalimage display, image quality such as fineness, brightness and largedisplay area, for example, must be realized.

[0009] The process of manufacturing an LCD device in a related artincludes forming a sealant pattern on one of the first and secondsubstrates to form an injection inlet, bonding the first and secondsubstrates to each other within a vacuum processing chamber, andinjecting liquid crystal material through the injection inlet. Inanother process of manufacturing an LCD device according to the relatedart, a liquid crystal dropping method, which is disclosed in JapanesePatent Application No. 11-089612 and 11-172903, includes dropping liquidcrystal material on a first substrate, arranging a second substrate overthe first substrate, and moving the first and second substrates to beadjacent to each other, and bonding the first and second substrates toeach other.

[0010] Compared to the liquid crystal injection method, the liquidcrystal dropping method is advantageous in that various processes suchas, formation of a liquid crystal material injection inlet, injection ofthe liquid crystal material, and sealing of the injection inlet areunnecessary since the liquid crystal material is predisposed on thefirst substrate. To this end, a variety of apparatuses for applying theliquid crystal dropping method have been recently researched.

[0011]FIGS. 1 and 2 show cross sectional views of a substrate assemblydevice using the liquid crystal dropping method according to the relatedart. In FIG. 1, the substrate assembly device includes a frame 10, anupper stage 21, a lower stage 22, a sealant dispenser (not shown), aliquid crystal material dispenser 30, a processing chamber including anupper chamber unit 31 and a lower chamber unit 32, a chamber movingsystem 40, and a stage moving system 50. The chamber moving system 40includes a driving motor driven to selectively move the lower chamberunit 32 to a location where the bonding process is carried out, or to alocation where the outflow of the sealant and dropping of the liquidcrystal material occur. The stage moving system 50 includes anotherdriving motor driven to selectively move the upper stage 21 along avertical direction perpendicular to the upper and lower stages 21 and22.

[0012] A process of manufacturing a liquid crystal display device usingthe substrate assembly device of FIGS. 1 and 2 is explained. First, asecond substrate 52 is loaded on the upper stage 21, and a firstsubstrate 51 is loaded upon the lower stage 22. Then, the lower chamberunit 32 having the lower stage 22 is moved to a processing location bythe chamber moving system 40 for sealant dispensing and liquid crystalmaterial dispensing. Subsequently, the lower chamber unit 32 is moved toa processing location for substrate bonding by the chamber moving system40. Thereafter, the upper and lower chamber units 31 and 32 areassembled together by the chamber moving system 40 to form a vacuumtight seal, and pressure in the chamber is reduced by a vacuumgenerating system.

[0013] Then, the upper stage 21 is moved downwardly by the stage movingsystem 50 at the above-mentioned vacuum state so as to closely contactthe second substrate 52 fixed to the upper stage 21 to the firstsubstrate 51 fixed to the lower stage 22. Further, the process ofbonding the respective substrates to each other is carried out through acontinuous pressurization, thereby completing the manufacture of the LCDdevice. Thus, after the bonding of the substrates is completed, theupper and lower chamber units 31 and 32 are separated from each other,and the lower chamber unit 32 is moved to an unloading position by thechamber moving system 40, and the bonded substrates are unloaded.

[0014] However, the substrate assembly device according to the relatedart is problematic. First, when upper and lower stages are pressed tobond the two substrates to each other, glass substrates may break due toexcessive pressure and equipment error. An operator will remove thebroken glass pieces but such broken glass pieces may not be easily andcompletely eliminated thus reducing an adhesive strength of a sealantand degrading liquid crystal property. Second, while the process ofloading and unloading the substrates is repeated, particles on thesubstrates remain inside the chamber, which degrades bonding. Third,static electricity may occur to damage inner circuits of the liquidcrystal display device.

SUMMARY OF THE INVENTION

[0015] Accordingly, the present invention is directed to a bondingdevice for manufacturing a liquid crystal display device thatsubstantially obviates one or more of the problems due to limitationsand disadvantages of the related art.

[0016] An advantage of the present invention is to provide a bondingdevice for manufacturing an LCD device, suitable for manufacturing alarge-sized LCD device and having an optimum size for an efficientlayout.

[0017] Another advantage of the present invention is to provide abonding device for manufacturing an LCD device, in which an efficientmanufacturing process is realized by reducing a processing time formanufacturing an LCD panel and by simplifying the movement and movementdirection of stages to efficiently align substrates.

[0018] Another advantage of the present invention is to provide abonding device for manufacturing an LCD device with an ionizing devicefor preventing static electricity which may be generated during theprocess of loading and unloading the substrates.

[0019] Additional features and advantages of the invention will be setforth in the description which follows, and in part will be apparentfrom the description, or may be learned by practice of the invention.The objectives and other advantages of the invention will be realizedand attained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

[0020] To achieve these and other advantages and in accordance with thepurpose of the present invention, as embodied and broadly described, abonding device for manufacturing an LCD device of the present inventionincludes a bonding chamber for bonding first and second substrates andan ionizing device for ionizing air or gases which flow into the bondingchamber.

[0021] Preferably, the ionizing device is movably located in front of anopening of the bonding chamber. The bonding device further includes acylinder fixed to a base of the bonding device and an elevating axis forelevating the ionizing device as the cylinder is driven. The ionizingdevice and the elevating axis are coupled to each other such that theionizing device is rotatable. The ionizing device includes a pluralityof holes formed on one side of a sealed pipe, a plurality of iongenerating tips formed in front of the holes of the sealed pipe forgenerating the ion, and a supply pipe for providing air or gases to thesealed pipe. The ionizing device includes first and second ionizingdevices movably formed on upper and lower parts, in front of an openingof the bonding device.

[0022] Preferably, the bonding device further includes a first cylinderfixed to the base of the bonding device, a first elevating axis forelevating a first ionizing device as the first cylinder is driven, asecond cylinder fixed to an upper frame of the bonding device, and asecond elevating axis for elevating a second ionizing device as thesecond cylinder is driven. The first and second ionizing devices and thefirst and second elevating axes are respectively coupled such that thefirst and second ionizing devices are rotatable. The first and secondionizing devices include a plurality of holes formed on one side of asealed pipe, a plurality of ion generating tips formed in front of theholes for generating an ion, and a supply pipe for providing air orgases to the sealed pipe.

[0023] In another aspect of the present invention, a bonding device fora liquid crystal display device includes a bonding chamber for bondingfirst and second substrates, a vent pipe for venting the bondingchamber, and an ionizing device formed on the vent pipe for ionizing airor gases which flow into the bonding chamber through the vent pipe.

[0024] Preferably, the ionizing device includes an ion generating pipeconnected to the vent pipe, and a plurality of ion generating tipsformed inside the ion generating pipe for generating an ion. Theionizing device is formed on each of a plurality of vent pipes. Theionizing device is selectively formed on one or more of a plurality ofvent pipes.

[0025] In another aspect of the present invention, a bonding device fora liquid crystal display device includes a bonding chamber for bondingfirst and second substrates, a vent hole for venting the bondingchamber, and an ionizing device formed inside the bonding chamberadjacent the vent hole for ionizing air or gases which flow into thebonding chamber through the vent hole.

[0026] Preferably, the ionizing device includes a supporting means fixedinside the bonding chamber adjacent the vent hole and a plurality of iongenerating tips formed on the supporting means for generating ion. Theionizing device is provided inside the bonding chamber adjacent aplurality of vent holes. One or more ionizing devices are selectivelyformed inside the bonding chamber adjacent the plurality of vent holes.The ionizing device is rotatably formed inside the bonding deviceadjacent the vent holes.

[0027] It is to be understood that both the foregoing generaldescription and the following detailed description are exemplary andexplanatory and are intended to provide further explanation of theinvention as claimed.

BRIEF DESCRIPTION OF THE DRAWING

[0028] The accompanying drawings, which are included to provide afurther understanding of the invention and are incorporated in andconstitute a part of this specification, illustrate embodiments of theinvention and together with the description serve to explain theprinciples of the invention.

[0029] In the drawings:

[0030]FIG. 1 is a schematic diagram illustrating a substrate assemblydevice based on a liquid crystal dropping type of the related art at theliquid crystal dropping stage;

[0031]FIG. 2 is a schematic diagram illustrating a substrate assemblydevice based on a liquid crystal dropping type of the related art at thesubstrate bonding stage;

[0032]FIG. 3 is a simplified schematic diagram illustrating a bondingdevice for manufacturing an LCD device based on a liquid crystaldropping type in accordance with the present invention;

[0033]FIG. 4 is a simplified schematic diagram illustrating an ionizingdevice of a bonding chamber in accordance with the first embodiment ofthe present invention;

[0034]FIG. 5 is a simplified schematic diagram illustrating an ionizingdevice of a bonding chamber in accordance with the second embodiment ofthe present invention;

[0035]FIG. 6 is a perspective view illustrating an ionizing device inaccordance with the first and second embodiments of the presentinvention;

[0036]FIG. 7 is an enlarged sectional view illustrating an ionizingdevice in accordance with the first and second embodiments of thepresent invention;

[0037]FIG. 8 is a simplified schematic diagram of an ionizing deviceinstalled on a vent pipe in accordance with the third embodiment of thepresent invention;

[0038]FIG. 9 is a simplified schematic diagram illustrating an ionizingdevice of a bonding chamber in accordance with the fourth embodiment ofthe present invention; and

[0039]FIG. 10 is an enlarged diagram of the ionizing device of FIG. 9.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

[0040] Reference will now be made in detail to an embodiment of thepresent invention, example of which is illustrated in the accompanyingdrawings.

[0041]FIG. 3 is a simplified schematic diagram illustrating a bondingdevice for manufacturing an LCD device based on a liquid crystaldropping or applying type in accordance with the present invention.

[0042] Referring to FIG. 3, a bonding device of the present inventionfor manufacturing a liquid crystal display device includes a bondingchamber 110, upper stage 121, lower stage 122, stage moving devices 131and 132, vacuum device including suction pump 200, pipe 112 and valve112 a, venting device including vent pipe 113 and valve 113 a, and aloader 300. The bonding chamber 110 selectively becomes a vacuum stateor an atmospheric state to bond substrates by pressurizing them and byusing a pressure difference in order. An opening 111 is formed at apredetermined part of the circumference of the bonding chamber 110 forreceiving or removing each substrate.

[0043] An air discharge pipe 112 and a vent pipe 113 are connected toone side of the bonding chamber 110. The air discharge pipe 112discharges existing air in the bonding chamber by a suction force from avacuum device. The vent pipe 113 maintains the inside of the bondingchamber at an atmospheric state by having air or gases (N₂) flow intothe bonding chamber 110. In this way, the bonding chamber selectivelybecomes and recovers from the vacuum state. Although only one airdischarge pipe 112 and one vent pipe is shown in FIG. 3, a plurality ofair discharge pipes 112 and vent pipes may be formed. Valves 112 a and113 a electronically controlled for selectively opening and closing thepath of the pipes are formed on the air discharge pipe 112 and vent pipe113, respectively.

[0044] At an opening 111 of the bonding chamber 110, a door (not shown)is additionally formed to selectively open or close the opening 111. Thedoor may be a sliding door or a revolving door. Other suitableconstructions for the door can be used. When the sliding door or therevolving door is used, a sealant for sealing gaps is preferablyprovided.

[0045] Upper and lower stages facing each other are formed respectivelyon the upper and lower parts inside the bonding chamber 110. The firstand second substrates 510 and 520 brought into the bonding chamber by aloader 300 are fixed to the upper and lower stages 121 and 122 andplaced in proper positions in the bonding chamber.

[0046] On the upper and lower stages 121 and 122, one or more electricstatic chucks (ESC) 121 a and 122 a are provided to fix the substratesusing an electrostatic force. Also, one or more vacuum holes 121 b areformed on the upper and lower stages to hold and bond the substratesusing vacuum force.

[0047] The electric static chucks 121 a and 122 a include a plurality ofpairs of flat electrodes, to which direct current power having differentpolarity is provided for an electrostatic bonding of the substrates.Alternatively, one electric static chuck 121 a having both polaritiescan be used to provide the electrostatic force.

[0048] The plurality of vacuum holes 121 b are formed along thecircumference of each of the electric static chucks 121 a provided atthe bottom of the upper stage 121. The respective vacuum holes 121 bcommunicate with each other through a plurality of paths 121 c. A vacuumforce is generated by a vacuum pump 123.

[0049] On one side of the lower stage 122, one or more electrostaticchucks 122 a are provided to hold the substrates onto the stage byelectrostatic force and one or more vacuum holes (not shown) are formedto hold the substrates on the stage by vacuum force.

[0050] The stage moving system of the present invention includes anupper moving axis 131, a lower moving axis 132, and driving motors 133and 134. The moving axis 131 is driven to selectively move the upperstage 121 up and down. The rotating axis 132 is driven to selectivelymove the lower stage 122 in a lateral direction. The driving motors 133and 134 for selectively driving the respective axes extend from outsidethe bonding chamber to the inside of the bonding chamber and coupled tothe respective stages 121 and 122.

[0051] A driver 135 moves the lower stage 122 laterally when thesubstrates are being aligned.

[0052] The vacuum device delivers a suction force to place the bondingchamber 110 in a vacuum state. For this reason, the vacuum device has asuction pump 200 which is driven to generate an air suction force. Thesuction pump 200 is formed to communicate with the air discharge pipe112 of the bonding chamber 110.

[0053] The loader is separately provided outside the bonding chamber 110unlike other components provided inside the bonding chamber 110. Theloader loads and unloads the first substrate 510 on which liquid crystalis applied and the second substrate 520 on which a sealant is applied inand out of the bonding chamber 110.

[0054] The loader has a first arm 310 for conveying the first substrate510 with the liquid crystal and a second arm 320 for conveying thesecond substrate 520 with the sealant. Before the substrates 510 and 520on the arms 310 and 320 are transferred to the inside of the bondingchamber 110, the first arm 310 is positioned higher than the second arm320.

[0055] The first arm 310 is positioned higher than the second arm 320 toprevent various kinds of foreign particles from being dropped onto theliquid crystal applied on the first substrate 510. In other words, ifthe second arm 320 is positioned higher than the first arm 310, variouskinds of foreign particles may be dropped onto the liquid crystal of thefirst substrate 510 as the second arm 320 moves.

[0056] The first arm 310 does not necessarily transfer only the firstsubstrate 510 with the liquid crystal and the second arm 320 does notnecessarily transfer only the second substrate 520 with the sealant.Preferably, however, the first arm 310 conveys only the substrate withthe liquid crystal and the second arm 320 conveys only the substratewith the sealant. Alternatively, if one substrate is provided with boththe liquid crystal and the sealant, the first arm 310 may convey thissubstrate and the second arm 320 may convey the other substrate.

[0057] The bonding device of the present invention further includes analignment device 600 for checking the alignment status of the substrates510 and 520 brought into the bonding chamber 110 to be loaded onto thestages 121 and 122 by the loader. The alignment device 600 may beprovided inside or outside the bonding chamber 110. In explaining thealignment device, however, the alignment device 600 is shown to beoutside of the bonding chamber 110.

[0058] The substrate bonding process using a bonding system of thepresent invention will be described below.

[0059] A first substrate with a liquid crystal and a second substratewith a sealant are provided. The first substrate may be provided withboth the liquid crystal and the sealant. As shown in a dotted line inFIG. 3, a loader 300 has the first substrate 510 on a stand-by positionat the upper side using a first arm 310. The loader 300 places thesecond substrate 520 with its surface with the sealant facing down belowthe first arm 310 using a second arm 320.

[0060] When an opening 111 of the bonding chamber 110 is opened, theloader 300 controls the second arm 320 to load the second substrate 520inside the bonding chamber 110 through the opening 111 with the sealantfacing down. An upper stage 121 is placed on the upper side of thesecond substrate 520. A vacuum pump 123 coupled to the upper stage 121delivers a vacuum force to vacuum holes 121 b formed on the upper stage121 so that the upper stage 121 holds and fixes the second substrate 520brought in by the second arm 320. Then, the upper stage 121 with thesecond substrate 520 ascends.

[0061] The loader controls the first arm 310 so that the first substrate510 with the liquid crystal is loaded into the bonding chamber 110 andonto the lower stage 122. Similarly to the upper stage 121, a vacuumpump (not shown) connected to the lower stage 122 delivers a vacuumforce to vacuum holes (not shown) formed on the lower stage 122 to holdand fix the first substrate 510 brought in by the first arm 310. In thisway, the first substrate 510 is attached to the lower stage 122.

[0062] The second substrate 520 with the sealant is preferably broughtin before the first substrate 510 with the liquid crystal. Otherwise,dust which may be generated while the second substrate 520 is beingbrought in may be undesirably dropped on the liquid crystal of the firstsubstrate 510.

[0063] Since the bonded substrates are already provided on the lowerstage from completing the bonding process, the second arm 320 unloadsthe bonded substrates on the lower stage after bringing in the nextsecond substrate for the next bonding process. In this way, theprocesses of loading and unloading are performed efficiently, therebyreducing the processing time.

[0064] When the loading process of the respective substrates 510 and 520is completed, the arms 310 and 320 of the loader 300 exit the bondingchamber 110. Also, the door of the opening 111 of the bonding chamber110 closes to seal the bonding chamber 110, as shown in FIG. 3.

[0065] Then, although not shown in FIG. 3, a substrate receiver isplaced under the upper stage and the second substrate is placed on thesubstrate receiver from the upper stage. The bonding chamber thenbecomes a vacuum state. In other words, a suction pump (vacuum device)200 is driven to generate a suction force which is delivered into thebonding chamber 110 through valve 112 a in the air discharge pipe 112.Therefore, the bonding chamber 110 goes under vacuum.

[0066] When the bonding chamber 110 is in the vacuum state, the suctionpump 200 stops and the valve 112 a operates to keep the air dischargepipe 112 closed. Also, the upper and lower stages 121 and 122 activatetheir respective electro static chucks 121 a and 122 a to hold and fixthe substrates 510 and 520. Then, the substrate receiver, whichtemporarily held the second substrate 520, is replaced to its originalposition.

[0067] In this state, a stage moving system drives a driving motor 133to move the upper stage 121 downward to near the lower stage 122. Thealignment device 600 checks the alignment status of the substrates 510and 520 bonded to the respective stages 122 and 121 and also provides acontrol signal to moving axes 131 and 132 to align the substrates.

[0068] The stage moving device moves the second substrate 520 on theupper stage 121 to the first substrate 510 on the lower stage 520 tobond them together by pressing them. In this way, the first bondingprocess is performed. The first bonding process in which the substratesare bonded by pressing of the stages 121 and 122 does not necessarilycomplete the bonding process. In this process, the substrates arepreferably bonded such that air cannot flow into the space or intervalbetween the substrates when the bonding chamber returns to theatmospheric state.

[0069] When the first bonding process is completed, the valve 113 aoperates to open the vent pipe 113 so that dry air or N₂ gas can flowinto the bonding chamber 110. Accordingly, the bonding chamber 110returns to the atmospheric state and the bonded substrates are pressedtogether by an atmospheric pressure difference. That is, because theinside of the bonding chamber is at the atmospheric state while theinterval between the first and second substrates sealed by the sealantis in the vacuum state, the substrates are pressed to each other by aconstant pressure. In this way, the substrates are bonded morecompletely. After the bonding process, the door at the opening 111 ofthe bonding chamber 110 is driven to open.

[0070] Then, the loader 300 performs the unloading process of the bondedsubstrates and repeats the above-described processes to bond the nextsubstrates.

[0071] Because the bonding device of the present invention uses the ESCmethod to hold the substrates, static electricity may occur when thesubstrates are loaded and unloaded. To prevent static electricity, anionizing method may be applied.

[0072]FIG. 4 is a simplified schematic diagram of an ionizing device fora bonding device in accordance with the first embodiment of the presentinvention.

[0073] As shown in FIG. 4, the ionizing device of the first embodimentof the present invention includes a cylinder 700 and an ionizing device702. The cylinder 700 for elevating the ionizing device 702 is placed infront of an opening 111 of the bonding chamber 110 and is preferablyfixed to a base 100 of the bonding device. The ionizing device 702 isrotatably formed on an elevating axis 701 which moves up and down by theoperation of the cylinder 700. This eliminates residue staticelectricity at the lower stage 122.

[0074]FIG. 5 is a simplified schematic diagram of an ionizing device ofa bonding device in accordance with the second embodiment of the presentinvention. As shown in FIG. 5, the ionizing device is respectivelyformed at the upper and lower parts of the opening 111 of the bondingchamber 110. In particular, in front of the opening 111 of the bondingchamber 110, a first cylinder 700 for elevating the ionizing device isprovided and preferably fixed to the base 100 of the bonding device.Also, a first elevating axis 701 is provided for vertical movement by anoperation of the first cylinder 700. The first ionizing device 702 isprovided on the first elevating axis 701, preferably such that it canrotate on the first elevating axis 701. In front of the opening 111 ofthe bonding chamber 110, a second cylinder 703, a second elevating axis704, and a second ionizing device 705 are formed. The second cylinder703 for elevating the ionizing device 705 is preferably fixed to anupper frame 710 of the bonding device. The second elevating axis 704moves up and down by the operation of the second cylinder 703. Thesecond ionizing device 705 is formed on the second elevating axis 704.Similarly, it is preferred that the second ionizing device 705 is ableto rotate on the second elevating axis 704.

[0075] The second embodiment of the present invention can eliminatestatic electricity at the upper stage as well as the lower stage. Theupper stage may have a less possibility of having the staticelectricity. However, if the electro static chuck (ESC) is provided inboth the upper and lower stages, the stages are preferably provided withseparate ionizing air and gases, by which the remaining staticelectricity can be eliminated more completely in the second embodimentthan in the first embodiment.

[0076] The ionizing device will be described in more detail below.

[0077]FIG. 6 is a perspective view of an ionizing device in accordancewith the first and second embodiments of the present invention and FIG.7 is an enlarged sectional view of an ionizing device in accordance withthe first and second embodiments of the present invention.

[0078] The first and second ionizing devices 702 and 705 have “L”-shapedpipes with lengths corresponding to the width of the respective openings111. On their upper face, the first and second ionizing devices 702 and705 have a single hole or a plurality of holes 706 for blowing air or N₂gas. FIG. 6 shows a plurality of holes 706 corresponding to iongenerating tips 707 arranged at their front. However, other suitableembodiments are contemplated such as N number of holes 706 and M numberof ion generating tips, where N and M are integers greater than or equalto 1. A supply pipe 709 for providing the air or gases is connected tothe pipe. The first and second elevating axes 701 and 704 and the firstand second ionizing devices 702 and 705 are preferably connected by ahinge axis 708 in a rotatable way.

[0079] Also, the first and second ionizing devices 702 and 705 may benarrower than as shown in FIG. 6 with a smaller number of holes 706 andionizing tips 707. In this instance, the ionizing devices 702 and 705may be capable of moving not only in a rotating fashion but also in alateral direction do cover the length of the opening 111 to ensure thations are sufficiently introduced into the bonding chamber.

[0080] An operation of an ionizing device in accordance with the firstand second embodiments of the present invention will be described.

[0081] As described above, after the first and second substrates 510 and520 are bonded in a vacuum state, the substrates 510 and 520 are pressedtogether as the bonding chamber is vented. Then, the door is opened atthe opening 111 to drive the cylinders 700 and 703 right before theloader 300 unloads the pressed substrates. As the cylinders are driven,the ionizing devices 702 and 705 are placed in front of the opening 111.Air or gases blow ions generated from ion generating tips 707 so thatthe air or gases flow into the bonding chamber 110. The ionizing devices702 and 705 rotatably coupled to the elevating axes 701 and 704 arerotated in a predetermined angle so that the ionizing air or gases canevenly flow into the bonding chamber 110.

[0082] After a predetermined time after the ionizing air or gases flowinto the bonding chamber 110, the cylinder is driven to replace theionizing device to its original place. Then, the loader 300 unloads thebonded substrates and loads next substrates to be newly bonded into thebonding chamber 110.

[0083] When the ionized air or gases flow into the bonding chamber, thestatic electricity generated when the bonded substrates 510 and 520 areseparated from the lower stage 122 or when the substrates are placed onthe respective stages can be prevented. In particular, because the upperand lower stages bond the substrates using the electro static chucks 121a and 122 a, the bonded substrates may have voltages remaining even whenthe voltage is turned off and not applied to the electro static chucks121 a and 122 a. Accordingly, there is a high possibility that staticelectricity will be generated on the substrates when a lift bar (notshown) lifts the bonded substrates to allow the loader to receive thesubstrates. However, the static electricity by the electro static chuckis prevented in the present invention because the substrates areunloaded after the ionizing air or gases flow into the bonding chamber.In this way, the inner circuits are protected.

[0084] Alternatively, the ionizing device 700 may be formed at theopening of the bonding chamber 110. For example, the vent pipe 113 mayhave an ionizing device to ionize the air or gases which flow into thebonding chamber 110 through itself. The ionizing device can be formed onall the vent pipes when a plurality of vent pipes are formed.

[0085]FIG. 8 is a simplified schematic diagram of an ionizing devicethat can be formed on a vent pipe in accordance with the thirdembodiment of the present invention. The ionizing device 800 of thethird embodiment has a plurality of ion generating tips 802 forgenerating ions inside an ion generating pipe 801 similar to the ventpipe 113. That is, the vent pipe 113 itself can have ion generating tips802. Also, the ionizing device can be installed either inside the ventpipe 113 or on a vent hole 113 b connected to the vent pipe 113.

[0086]FIG. 9 is a simplified schematic diagram of an ionizing device ofa bonding chamber in accordance with the fourth embodiment of thepresent invention and FIG. 10 is an enlarged diagram of the ionizingdevice of FIG. 9. The bonding device of the fourth embodiment of thepresent invention has the same construction as that of the thirdembodiment except that an ionizing device 900 is formed at a vent hole113 b connecting a vent pipe 113 with the bonding chamber 110. In otherwords, a support 903 is formed on an inner wall face of the bondingchamber, near the vent hole 113 b. Also, a plurality of ion generatingtips 902 are formed on the support 903 to ionize the air or gases whichflow into bonding chamber through the vent pipe 113.

[0087] At this time, the support 903 can be formed in a rotatable way inthe bonding chamber 110 so that the ionizing device 900 is rotatable.Also, a plurality of the vent holes such as four, for example, 113 b maybe formed. The ionizing device 900 can be formed either at all the ventholes or selectively at some of the vent holes.

[0088] An operation of an ionizing device of a bonding device inaccordance with the third and fourth embodiments of the presentinvention will be described below.

[0089] As described above, first and second substrates 510 and 520 areloaded in the bonding chamber 110. The bonding chamber 110 bonds thesecond substrate 520 at an upper stage 121 to the first substrate 510 ata lower stage 122 by pressing them together.

[0090] Then, dry air or N₂ gas flows into the bonding chamber 110 as avent pipe 113 is opened by a valve 113 a to place the bonding chamber110 in an atmospheric state. Accordingly, the bonded substrates arepressurized because of a pressure difference inside the bonding chamber110. That is, because the bonding chamber is in the atmospheric stateand the interval or space between the first and second substrate is inthe vacuum state, a uniformly pressure is applied. The air or gaseswhich flow into the bonding chamber 110 through the vent pipe 113 areionized (N₂ ⁺, N₂ ⁻) by ions generated from ion generating tips 802 and902 of the ionizing devices 800 and 900, and the ionized air and gasesflow into the bonding chamber 110.

[0091] As the ionized air and gases flow into the bonding chamber,static electricity inside the bonding chamber is prevented. In thebonding device of the present invention, there is a high possibility ofstatic electricity generated during the process of loading and unloadingof the substrates because the substrates are held and fixed by anelectro static chuck. In the bonding device of the present invention,however, an ionizing device is formed on the vent pipe 113 or at thevent hole 113 b so that ionized air or gases evenly flow into thebonding chamber 110. In this way, the static electricity is prevented.

[0092] After the venting process, the door at the opening 111 of thebonding chamber is driven to open. Subsequently, the loader 300 unloadsthe bonded substrates and begins the processes to bond new substrates.

[0093] A bonding device and an ionizing device of the present inventionhave the following advantages.

[0094] First, in the present invention, the bonding device is providedas a separate device different from devices for applying a liquidcrystal or applying a sealant. Also, the bonding device is provided withsubstrates already having the liquid crystal and sealant, unlike therelated art bonding device in which the liquid crystal and sealant aredispensed at the bonding device. Accordingly, the bonding device of thepresent invention has much smaller size than that of the related art,thereby making it possible to efficiently design a layout and reducefootprint space.

[0095] Second, because the processes of applying the liquid crystal,applying the sealant, and bonding the substrates are performedsimultaneously in a pipeline fashion in different devices, the overallprocess time decreases.

[0096] Third, because the lower stage moves minimally, the alignment ofthe substrates is performed in a fast and precise way. In particular, asthe bonding chamber is formed as one integral unit, unlike the relatedart bonding chamber in which the chamber is divided into two parts,problems caused by leakage during the coupling of the two parts isprevented. Also, components for preventing such leakage are notrequired.

[0097] Fourth, the arm for bringing in the next one of the substratessuch as the substrate with the sealant, brings in the next substratebefore taking out the previously bonded substrates from the lower stage.Accordingly, the process time for bringing the next substrate and takingout the bonded substrates is reduced.

[0098] Fifth, even though the bonding device of the present inventionuses an electro static chuck to bond the substrates, undesirable staticelectricity is prevented because of ionized air or gases. The ionizedair or gases are blown into the bonding chamber right before the loadingand unloading of the substrates. Thus, inner circuits are prevented fromdamage by static electricity.

[0099] Sixth, as the ionizing device is rotatably formed in front of theopening of the bonding chamber to evenly provide ionized air or gases tothe bonding chamber, static electricity is more efficiently prevented.

[0100] Seventh, because the ionizing device is respectively formed onthe upper and lower parts of the opening of the bonding chamber, theupper and lower stages having a high possibility of residue staticelectricity are protected.

[0101] Eighth, because the ionizing device is formed on a vent pipe orat a vent hole to evenly provide the ionized air or gases into thebonding chamber, static electricity preventing effect increases.

[0102] It will be apparent to those skilled in the art that variousmodifications and variation can be made in the present invention withoutdeparting from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A bonding device for bonding first and second substrates of a liquid crystal display device comprising: a bonding chamber for bonding the first and second substrates; and an ionizer for introducing ions into the bonding chamber.
 2. A bonding device according to claim 1, wherein the ionizer blows air or gas into the bonding chamber and the ions are introduced into the bonding chamber by the air or gas.
 3. A bonding device of claim 1, wherein the ionizer is movably formed in front of an opening of the bonding chamber.
 4. A bonding device of claim 3, wherein the bonding device further comprises a support member fixed to a base of the bonding device; and an elevating member coupled to the support member and moving the ionizer vertically to be placed adjacent to the opening of the bonding chamber.
 5. A bonding device of claim 4, wherein the ionizing device is coupled to the elevating member and the ionizer rotates while being attached to the elevating member.
 6. A bonding device of claim 1, wherein the ionizer includes:
 6. The bonding device of claim 1, wherein the ionizing device includes first and second ionizing devices movably formed on upper and lower parts of an opening of the bonding device.
 7. The bonding device of claim 6, wherein the bonding device further comprises: a first cylinder fixed to the base of the bonding device; a first elevating axis for elevating a first ionizing device as the first cylinder is driven; a second cylinder fixed to an upper frame of the bonding device; and a second elevating axis for elevating a second ionizing device as the second cylinder is driven.
 8. The bonding device of claim 7, wherein the first and second ionizing devices and the first and second elevating axes are respectively united in a way that the first and second ionizing devices are rotatable.
 9. The bonding device of claim 6, wherein the first and second ionizing devices include: a plurality of holes formed on one side of a sealed pipe; a plurality of ion generating tips formed in front of the holes for generating an ion; and a supply pipe for providing air or gases to the sealed pipe. a first elevating member coupled to the first cylinder and moving the first ionizing device in a vertical direction; a second cylinder fixed to an upper frame of the bonding device; and a second elevating member coupled to the second cylinder and moving the second ionizing device in a vertical direction.
 14. A bonding device of claim 13, wherein the first and second ionizing devices rotate.
 15. A bonding device of claim 6, wherein the first and second ionizing devices include: a sealed pipe having a plurality of holes at one side; a plurality of ion generating tips formed adjacent the holes; and a supply pipe providing air or gases to the sealed pipe.
 16. A bonding device for bonding first and second substrates of a liquid crystal display device comprising: a bonding chamber for bonding the first and second substrates; a vent pipe for introducing air into the bonding chamber; and an ionizer coupled to the vent pipe, the ionizer introducing ions into the bonding chamber through the vent pipe.
 17. A bonding device of claim 16, wherein the ionizer includes: an ion generating pipe connected to the vent pipe; and a plurality of ion generating tips inside the ion generating pipe for generating ion.
 18. A bonding device of claim 16, further including a plurality of vent pipes and the ionizer is located in multiple of the vent pipes.
 19. A bonding device of claim 16, wherein the ionizer is located in one or more of the plurality of vent pipes.
 20. A bonding device for bonding first and second substrates of a liquid crystal display device comprising: a bonding chamber for bonding the first and second substrates; a vent hole in the bonding chamber, the vent hole venting the bonding chamber; and an ionizer located adjacent the vent hole of the bonding chamber, the ionizer introducing ions into the bonding chamber.
 21. A bonding device of claim 20, wherein the ionizer is located inside the bonding chamber adjacent the vent hole.
 22. A bonding device of claim 21, wherein the ionizer includes: a support member fixed inside the bonding chamber adjacent the vent hole; and a plurality of ion generating tips on the support member for generating ion.
 23. A bonding device of claim 20, wherein the ionizer includes: a support member fixed to the bonding chamber adjacent the vent hole; and a plurality of ion generating tips coupled to the support member.
 24. A bonding device of claim 20, further comprising a plurality of vent holes in the bonding chamber and the ionizer is located adjacent a multiple of the vent holes.
 25. A bonding device of claim 20, wherein the ionizer is located in one or more of the plurality of vent pipes.
 26. A bonding device of claim 20, wherein the ionizer rotates near the vent holes.
 27. A bonding device for bonding first and second substrates of a liquid crystal display device comprising: a bonding chamber for bonding the first and second substrates; and a means for introducing ions into the bonding chamber.
 28. A bonding device of claim 27, further including an ion opening in the bonding chamber and ions are introduced through the opening in the bonding chamber.
 29. A bonding device of claim 27, further including a vent pipe and the means for introducing ions into the bonding chamber includes means for introducing ions through the vent pipe.
 30. A bonding device of claim 27, further including a vent hole and the means for introducing ions into the bonding chamber introduces ions adjacent the vent hole.
 31. A method of bonding first and second substrates of a liquid crystal display device comprising: bonding the first and second substrates; and introducing ions into the bonding chamber.
 32. The method of claim 31, wherein the ions are introduced into the bonding chamber through an ion opening in the bonding chamber.
 33. The method of claim 31, the ions are introduced into the bonding chamber through a vent pipe coupled to the bonding chamber.
 34. The method of claim 31, the ions are introduced into the bonding chamber adjacent a vent hole in the bonding chamber. 